Mag-layers-usa GMPI-252010 F1 Manuel d'utilisateur télécharger pdf (Page 6)

MAG.LAYERS

GMPI-252010-F1 Series

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•MECHANICAL PERFORMANCE TEST

ITEM SPECIFICATION TEST CONDITION

Solderability

More than 90% of the terminal electrode shall

be covered with fresh solder.

Solder:

Sn-3.0Ag-0.5Cu

Solder Temperature:

245 ± 5℃

Flux: Rosin

Dip Time: 3 ± 1 Seconds

Soldering Heat Resistance

The chip shall not crack.

More than 75% of the terminal electrode shall

be covered with solder.

Solder temperature : 260 ± 5℃

Flux: Rosin

Dip time: 10 ± 1 seconds

TYPE W(KGF)

Time (Sec)

GMPI-160808 0.6

GMPI-201205 0.8

GMPI-201209 0.6

GMPI-201610 1.0

GMPI-252005 1.5

GMPI-252010

GMPI-252012

GMPI-321608

GMPI-322510

Terminal Strength

The terminal electrode shall not be broken off

nor the ferrite damaged.

W

GMPI-322512

1.0

30±5

TYPE W(KGF)

Time (Sec)

GMPI-160808

GMPI-201205

GMPI-201209

GMPI-201610

1.0

GMPI-252005

GMPI-252010

GMPI-252012

GMPI-321608

GMPI-322510

Terminal Strength

The terminal electrode shall not be broken off

nor the ferrite damaged.

GMPI-322512

2.0

10±5

TYPE A(MM)

P(KGF)

GMPI-160808 1.0 0.6

GMPI-201205

GMPI-201209

1.4 1.0

GMPI-201610 2.0

GMPI-252005 1.0

GMPI-252010

GMPI-252012

GMPI-321608

GMPI-322510

Bending Strength

No mechanical damage.

The ferrite shall not be damaged.

A

Chip

P

1.0

R0.5

GMPI-322512

2.0

2.0

Bending Test

Appearance: No damage

Substrate:PCB(100mm×40mm×1.6mm)

Solder: Reflow

Speed of Applying Force: 0.5mm / s

Deflection: 2mm

Hold Duration: 30 s

W

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